Panelizing circuit boards is one of the most cost effective methods of increasing through-put in the surface mount operation. Multiple circuit boards can simultaneously receive solder paste and go through component placement and reflow. The disadvantage is that the individual boards must be depaneled before final assembly. There are many processes for depaneling assemblies, and in every case holding the panel and individual boards secure is critical to quality and reliability. Routing and laser system can easily damage a circuit board if any misalignment occurs.

Ascentec Engineering offers several depaneling systems including an adjustable pin system, dedicated pinned panels with backside component clearance and a vacuum system for holding panels flat with no additional tooling. Please contact us with your unique requirements.