Surface mount technology has revolutionized the electronic assembly industry. Direct attachment of components and devices to the surface of circuit boards has enabled products with much higher circuit speeds, greater circuit density, and fewer external connections. These advances have greatly lowered costs, improved performance and improved product reliability.

These benefits come with challenges as any surface mount process engineer knows. Printing solder paste on diminishing pad sizes, placing smaller and smaller components, and reflowing entire assemblies with their varieties of termination finishes and materials are just a few of the technical challenges that process engineers face every day.

Ascentec Engineering offers a variety of tooling solutions to improve the reliability, quality and cost effectiveness of surface mount processes. Full process carriers support circuit boards through all steps in the surface mount process. They offer support and accurate location for assemblies with odd board outlines or that don’t meet standard conveyor widths. These fixtures can also be used to manage difficult components that require alignment or thermal protection through the reflow process.

Other specialty tooling for repair, inspection and rework are available. Please let us know how we can help you.